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Hak Jun Kim 1 Article
Atomistic Simulation of Sintering Mechanism for Copper Nano-Powders
Yujin Seong, Sungwon Hwang, See Jo Kim, Sungho Kim, Seong-Gon Kim, Hak Jun Kim, Seong Jin Park
J Powder Mater. 2015;22(4):247-253.   Published online August 1, 2015
DOI: https://doi.org/10.4150/KPMI.2015.22.4.247
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AbstractAbstract PDF

The sintering mechanisms of nanoscale copper powders have been investigated. A molecular dynamics (MD) simulation with the embedded-atom method (EAM) was employed for these simulations. The dimensional changes for initial-stage sintering such as characteristic lengths, neck growth, and neck angle were calculated to understand the densification behavior of copper nano-powders. Factors affecting sintering such as the temperature, powder size, and crystalline misalignment between adjacent powders have also been studied. These results could provide information of setting the processing cycles and material designs applicable to nano-powders. In addition, it is expected that MD simulation will be a foundation for the multi-scale modeling in sintering process.

Citations

Citations to this article as recorded by  
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    Applied Mathematical Modelling.2023; 114: 408.     CrossRef
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    MATERIALS TRANSACTIONS.2023; 64(10): 2542.     CrossRef
  • Enhancement in electrical conductivity of pastes containing submicron Ag-coated Cu filler with palmitic acid surface modification
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    Applied Surface Science.2017; 415: 67.     CrossRef

Journal of Powder Materials : Journal of Powder Materials